The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2008

Filed:

Oct. 17, 2005
Applicants:

Tomohiko Iwane, Fukuyama, JP;

Nakae Nakamura, Fukuyama, JP;

Inventors:

Tomohiko Iwane, Fukuyama, JP;

Nakae Nakamura, Fukuyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a connection structure of the present invention, the wiring board including a solder resist covering part which covers the wiring pattern with solder resist, the solder resist covering part having a solder resist opening or solder resist openings which expose(s) the wiring board connection terminals therethrough, and the solder resist opening or the solder resist openings surrounding at least one part of the solder resist covering part. Therefore, the wiring patterns are not unnecessarily exposed. That is, without disadvantageous contact between each wiring pattern and the semiconductor element, the semiconductor element can be mounted on the wiring board, and thus, the semiconductor device is reliable.


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