The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Feb. 19, 2003
Masami Kanamaru, Chiba, JP;
Yutaka Minami, Chiba, JP;
Ryo Aburatani, Chiba, JP;
Tomio Tatsumi, Chiba, JP;
Masami Kanamaru, Chiba, JP;
Yutaka Minami, Chiba, JP;
Ryo Aburatani, Chiba, JP;
Tomio Tatsumi, Chiba, JP;
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a process for producing a buten-1-based polymer satisfying the following requirements (a), (b) and (c): (a) a crystalline resin having a melting point (Tm-D) of 0 to 100° C., the melting point being defined as a top of a peak observed on a highest-temperature side in a melting endothermic curve obtained by a differential scanning calorimeter (DSC) when a sample is held in a nitrogen atmosphere at −10° C. for 5 min and then heated at a temperature rise rate of 10° C./min; (b) a stereoregularity index represented by (mmmm)/(mmrr+rmmr) of 20 or less; and (c) a weight-average molecular weight (Mw) of 10,000 to 1,000,000 and a ratio (Mw/Mn) of weight-average molecular weight to number-average molecular weight of 4.0 or less; a modified buten-1-based polymer produced by modifying the buten-1-based polymer with a radical polymerization initiator and an organic acid; and an adhesive composition containing the modified buten-1-based polymer. The modified buten-1-based polymer of the present invention is capable of imparting a high adhesiveness, a high strength and a good softness to polyolefins, and providing sealants having a high adhesiveness, or polyolefins having an improved compatibility to inorganic fillers, etc., in particular, is useful as resins for hot-melt adhesives.