The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Dec. 01, 2006
Shaw Wei Lee, Cupertino, CA (US);
Nghia Thuc Tu, San Jose, CA (US);
Santhiran S/o Nadarajah, Melaka, MY;
Lim Peng Soon, Melaka, MY;
Shaw Wei Lee, Cupertino, CA (US);
Nghia Thuc Tu, San Jose, CA (US);
Santhiran S/O Nadarajah, Melaka, MY;
Lim Peng Soon, Melaka, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.