The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Apr. 22, 2005
Jeremy A. Palmer, Albuquerque, NM (US);
Donald W. Davis, Albuquerque, NM (US);
Bart D. Chavez, Albuquerque, NM (US);
Phillip L. Gallegos, Albuquerque, NM (US);
Ryan B. Wicker, El Paso, TX (US);
Francisco R. Medina, El Paso, TX (US);
Jeremy A. Palmer, Albuquerque, NM (US);
Donald W. Davis, Albuquerque, NM (US);
Bart D. Chavez, Albuquerque, NM (US);
Phillip L. Gallegos, Albuquerque, NM (US);
Ryan B. Wicker, El Paso, TX (US);
Francisco R. Medina, El Paso, TX (US);
Sandia Corporation, Albuquerque, NM (US);
Abstract
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.