The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Sep. 13, 2002
Chi Hsien Sheu, Los Angeles, CA (US);
Denise M. Shimazu, Los Angeles, CA (US);
David Michael Kane, Torrance, CA (US);
Chi Hsien Sheu, Los Angeles, CA (US);
Denise M. Shimazu, Los Angeles, CA (US);
David Michael Kane, Torrance, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
According to one embodiment of the invention, a co-cured vacuum-assisted resin transfer molding manufacturing method includes providing a tool base, disposing a prepreg skin panel outwardly from the tool base, disposing one or more tooling details outwardly from the prepreg skin panel, and disposing one or more preforms proximate the one or more tooling details. The one or more preforms are either dry or binderized. The method further includes disposing a high permeability medium between the one or more tooling details and the one or more preforms, enclosing the prepreg skin panel, the one or more tooling details, the one or more preforms, and the high permeability medium with at least one vacuum bag, pulling a vacuum on the vacuum bag, infusing the one or more preforms with a resin, and curing the one or more preforms and the prepreg skin panel.