The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2008

Filed:

Feb. 01, 2005
Applicant:

Timothy F. Spencer, Rochester, NY (US);

Inventor:

Timothy F. Spencer, Rochester, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for encapsulating an area on a substrate comprising the steps of a) providing a substrate having an area on a surface thereof which is to be encapsulated, b) providing an assembly fixture which has features formed into the surface of the fixture, and vacuum orifices associated with the features of the fixture, c) positioning a substantially flat formable sheet onto the assembly fixture, and forming the sheet to the features of the assembly fixture by applying a negative pressure through the vacuum orifices, wherein corresponding features are formed in the sheet, d) patterning an adhesive onto the sheet or onto the substrate, the adhesive pattern corresponding to the perimeter of the area on the substrate to be encapsulated, e) clamping together the substrate and the sheet, causing the patterned adhesive to flow between the substrate and sheet in the area of compression, wherein the patterned adhesive is proximate to the features formed in the sheet, and f) curing the adhesive to form a perimeter seal between the substrate and the sheet.


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