The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2008

Filed:

Oct. 30, 2006
Applicants:

Daigo Suzuki, Yokohama, JP;

Akihiko Happoya, Fussa, JP;

Hidenori Tanaka, Hachioji, JP;

Inventors:

Daigo Suzuki, Yokohama, JP;

Akihiko Happoya, Fussa, JP;

Hidenori Tanaka, Hachioji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a printed circuit board includes a first dielectric layer, a circuit component mounted on the first dielectric layer, and a second dielectric layer. The first dielectric layer is provided with a via hole which opens at a surface thereof and in which a conductive layer is provided, and a conductive pattern connected electrically to the conductive layer of the via hole. The circuit component is provided with a bump at least a part of which is inserted in the via hole and bonded to an inner surface of the via hole. The second dielectric layer is formed provided with another conductive pattern and laminated to the first dielectric layer to cover the circuit component.


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