The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2008
Filed:
Nov. 14, 2007
Seoung-su Ha, Chungcheongnam-do, KR;
Jin-won Kang, Chungcheongnam-do, KR;
Jung-hyeon Kim, Gyeonggi-do, KR;
Se-jun Yu, Chungcheongnam-do, KR;
Seoung-Su Ha, Chungcheongnam-do, KR;
Jin-Won Kang, Chungcheongnam-do, KR;
Jung-Hyeon Kim, Gyeonggi-do, KR;
Se-Jun Yu, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.