The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Jan. 03, 2006
Applicants:
Kiyoomi Kadoya, Hitachinaka, JP;
Masahiro Sasaki, Hitachinaka, JP;
Takuya Mayuzumi, Hitachinaka, JP;
Inventors:
Kiyoomi Kadoya, Hitachinaka, JP;
Masahiro Sasaki, Hitachinaka, JP;
Takuya Mayuzumi, Hitachinaka, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/14 (2006.01); H05K 7/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
In resin-molded engine control unit, a coil, an electrolytic capacitor, a microprocessor, electronic parts and a connector terminal are mounted on a board. Inside a cover fixed on the board, a resin-free region is formed. The coil, the electrolytic capacitor and the microprocessor, which should not be sealed with resin, are mounted in the resin-free region, while the board and the electronic parts which are not capped by the cover are sealed with a resin.