The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7417862 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 26, 2008

Filed:

Jul. 11, 2005
Applicant:

Wen-chuan Lo, Taoyuan Hsien, TW;

Inventor:

Wen-Chuan Lo, Taoyuan Hsien, TW;

Assignee:

Delta Electronics, Inc., Taoyuan Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink fixing device for fixing a heat sink on a printed circuit board is disclosed. The fixing device comprises a connecting portion fixed on one side of the heat sink, an extension portion connected with the connecting portion, a first pin extended downward from partial lower edge of the extension portion for plugging into the printed circuit board, and a second pin extended downward from partial lower edge of the connecting portion and connected with the first pin for plugging into the printed circuit board. The heat sink fixing device can strengthen the pin structure, increase the tin soldering area and fix the heat sink on the printed circuit board firmly.


Find Patent Forward Citations

Lo, Wen-Chuan. (2008). Heat sink fixing device (U.S. Patent No. 7417862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7417862

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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