The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Mar. 02, 2005
Hiroyasu Tsuchida, Kanagawa, JP;
Tatsumi Tsuchiya, Kanagawa, JP;
Takaaki Murokawa, Kanagawa, JP;
Yuhsuke Matsumoto, Kanagawa, JP;
Yoshio Uematsu, Kanagawa, JP;
Tatsuya Tanaka, Kanagawa, JP;
Hiroyasu Tsuchida, Kanagawa, JP;
Tatsumi Tsuchiya, Kanagawa, JP;
Takaaki Murokawa, Kanagawa, JP;
Yuhsuke Matsumoto, Kanagawa, JP;
Yoshio Uematsu, Kanagawa, JP;
Tatsuya Tanaka, Kanagawa, JP;
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.