The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Apr. 26, 2004
Tohru Nomura, Kariya, JP;
Yoshihiro Shimoide, Aichi-pref, JP;
Yoshihiko Shiraishi, Nagoya, JP;
Rikiya Kamimura, Toyoake, JP;
Hiroshi Kasugai, Toyoake, JP;
Tohru Nomura, Kariya, JP;
Yoshihiro Shimoide, Aichi-pref, JP;
Yoshihiko Shiraishi, Nagoya, JP;
Rikiya Kamimura, Toyoake, JP;
Hiroshi Kasugai, Toyoake, JP;
Denso Corporation, , JP;
Abstract
A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.