The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Dec. 01, 2005
Applicant:
Myung Geun Park, Seoul, KR;
Inventor:
Myung Geun Park, Seoul, KR;
Assignee:
Hynix Semiconductor Inc., Kyoungki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
The stack type package module includes a plurality of stacked tape carrier packages. Each package has an elongated lead having an extension end connected to the first lateral end connected to a central portion connected to a second lateral end. The second lateral end is connected to the respective chip via a bump. The packages made as such are then stacked on top of each other on a printed circuit board. The plurality of the stacked first lateral ends are then cut and soldered the printed circuit board. The predetermined portions of the packages including the cut first lateral ends are sealed for protection.