The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
May. 22, 2003
Applicants:
Bernd Betz, Neutraubling, DE;
Jochen Dangelmaier, Beratzhausen, DE;
Rudolf Lehner, Laaber, DE;
Stefan Paulus, Zeitlarn, DE;
Inventors:
Bernd Betz, Neutraubling, DE;
Jochen Dangelmaier, Beratzhausen, DE;
Rudolf Lehner, Laaber, DE;
Stefan Paulus, Zeitlarn, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a radiofrequency power semiconductor module having a cavity housing constructed from three modules, a 1st module, which has an upwardly and downwardly open housing frame with horizontally arranged flat conductors, a 2nd module, which has the chip island as a heat sink with at least one radiofrequency semiconductor component, the 2nd module forming the bottom of the cavity housing, and a 3rd module, which has the housing cover.