The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Mar. 20, 2002
Hironao Fujiki, Usui-gun, JP;
Kazuhiko Tomaru, Usui-gun, JP;
Ikuo Sakurai, Usui-gun, JP;
Akio Suzuki, Usui-gun, JP;
Kunihiko Mita, Usui-gun, JP;
Hironao Fujiki, Usui-gun, JP;
Kazuhiko Tomaru, Usui-gun, JP;
Ikuo Sakurai, Usui-gun, JP;
Akio Suzuki, Usui-gun, JP;
Kunihiko Mita, Usui-gun, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.