The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2008

Filed:

Feb. 27, 2003
Applicants:

Toshirou Kisakibaru, Tokyo, JP;

Shigeru Kouchiyama, Tokyo, JP;

Makoto Okada, Tokyo, JP;

Kouta Ueno, Tokyo, JP;

Inventors:

Toshirou Kisakibaru, Tokyo, JP;

Shigeru Kouchiyama, Tokyo, JP;

Makoto Okada, Tokyo, JP;

Kouta Ueno, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B65B 69/00 (2006.01); B01D 50/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a semiconductor-fabrication equipment of a minienvironment system, ambient air is prevented from entering a gap between an opening of the semiconductor-fabrication equipment and a wafer gateway of a hermetic container to prevent dust entrained in the ambient air from adhering to wafers in the hermetic container. Clean air is injected from a clean-air injection device (), which is connected to an air-supply device () through an air-supply tube (), and which is provided with filter means () in the from of rectangular frame formed with cylindrically-shaped filters connected to each other, to form an air curtain at the gap () between the gateway () of the hermetic container () through which wafers () are taken out of or put in the hermetic container () and the opening () of a loading part () attached to a front panel () of the semiconductor-fabrication equipment (), thereby shutting off the ambient air that would otherwise enter the hermetic container () through the gap () between the gateway () of the hermetic container () and the opening () of the loading part () attached to the semiconductor-fabrication equipment () when a lid () of the hermetic container () is opened into the semiconductor-fabrication equipment ().


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