The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Jan. 26, 2005
Tamotsu Yamamoto, Kawasaki, JP;
Hirofumi Watani, Kawasaki, JP;
Hideki Kitada, Kawasaki, JP;
Hiroshi Horiuchi, Kawasaki, JP;
Motoshu Miyajima, Kawasaki, JP;
Tamotsu Yamamoto, Kawasaki, JP;
Hirofumi Watani, Kawasaki, JP;
Hideki Kitada, Kawasaki, JP;
Hiroshi Horiuchi, Kawasaki, JP;
Motoshu Miyajima, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A multilayer interconnection structure includes a first interlayer insulation film, a second interlayer insulation film formed over the first interlayer insulation film, an interconnection trench formed in the first interlayer insulation film and having a sidewall surface and a bottom surface covered with a first barrier metal film, a via-hole formed in the second interlayer insulation film and having a sidewall surface and a bottom surface covered with a second barrier metal film, an interconnection pattern filling the interconnection trench, and a via-plug filling the via-hole, wherein the via-plug makes a contact with a surface of the interconnection pattern, the interconnection pattern has projections and depressions on the surface, the interconnection pattern containing therein oxygen atoms along a crystal grain boundary extending from the surface toward an interior of the interconnection pattern with a concentration higher than a concentration at the surface.