The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Feb. 28, 2005
Norio Kainuma, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Takayoshi Matsumura, Kawasaki, JP;
Kimio Nakamura, Kawasaki, JP;
Norio Kainuma, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Takayoshi Matsumura, Kawasaki, JP;
Kimio Nakamura, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chipincludes a step of providing a hardening trigger that is not heat to insulating adhesiveeither before the semiconductor chipis mounted on the substrateor during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrateby pressure welding or metal combining while hardening of the insulating adhesiveis progressing due to provision of the hardening trigger.