The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Mar. 30, 2007
Tsutomu Uchimi, Tokyo-To, JP;
Masayuki Nagashima, Tokyo-To, JP;
Masaru Kobayashi, Tokyo-To, JP;
Hiroyuki Shirogane, Tokyo-To, JP;
Tsutomu Uchimi, Tokyo-To, JP;
Masayuki Nagashima, Tokyo-To, JP;
Masaru Kobayashi, Tokyo-To, JP;
Hiroyuki Shirogane, Tokyo-To, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps having satisfactory height even by a smaller number of times of coating than that in the prior art technique. The electroconductive paste composition comprises a phenolic resin, a melamine resin, an electroconductive powder, a solvent, and a bump forming aid comprising a monohydric alcohol having a terminal methoxy group and having at least one ether bond. The electroconductive paste composition can be used in a printed wiring board.