The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2008

Filed:

Dec. 11, 2003
Applicants:

Seong-su Kim, Annyang-si, KR;

Yong-suk Choi, Seoul, KR;

Gee-sung Chae, Incheon, KR;

Gyoo-chul JO, Gunpo-si, KR;

Oh-nam Kwon, Suwon-si, KR;

Kyoung-mook Lee, Seoul, KR;

Yong-sup Hwang, Suwon Gyeonggi, KR;

Seung-yong Lee, Daejeon, KR;

Inventors:

Seong-Su Kim, Annyang-si, KR;

Yong-Suk Choi, Seoul, KR;

Gee-Sung Chae, Incheon, KR;

Gyoo-Chul Jo, Gunpo-si, KR;

Oh-Nam Kwon, Suwon-si, KR;

Kyoung-Mook Lee, Seoul, KR;

Yong-Sup Hwang, Suwon Gyeonggi, KR;

Seung-Yong Lee, Daejeon, KR;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight of a first additive having nitrogen; about 0.2% to about 5% by weight of a second additive having nitrogen; about 0.01% to about 1.0% by weight of a fluoric compound; and de-ionized water making a total amount of the etching solution 100% by weight.


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