The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
Sep. 29, 2003
Stuart D. Downes, Milford, MA (US);
Jin Liang, Southborough, MA (US);
Larry Norris, Quincy, MA (US);
Stuart D. Downes, Milford, MA (US);
Jin Liang, Southborough, MA (US);
Larry Norris, Quincy, MA (US);
EMC Corporation, Hopkinton, MA (US);
Abstract
A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming, for each pad profile, a soldering pad having a set of radii corresponding to the set of rounded corners of that pad profile to create a set of soldering pads for the component mounting location. Each soldering pad is configured for a high bond strength solder joint. The technique further involves removing the mask layer from the circuit board and soldering a component to the component mounting location. This technique is well-suited for robustly mounting the component to the circuit board at solder joints with relatively high solder joint bond strengths.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile