The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2008

Filed:

Jul. 01, 2005
Applicant:

Dieter Vischer, Zug, CH;

Inventor:

Dieter Vischer, Zug, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises:


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