The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2008
Filed:
Apr. 19, 2005
Masahiro Aoyagi, Tsukuba, JP;
Hiroshi Nakagawa, Tsukuba, JP;
Kazuhiko Tokoro, Tsukuba, JP;
Katsuya Kikuchi, Tsukuba, JP;
Yoshikuni Okada, Tsukuba, JP;
Hiroyuki Fujita, Kawasaki, JP;
Kenichi Kobayashi, Kawasaki, JP;
Masahiro Aoyagi, Tsukuba, JP;
Hiroshi Nakagawa, Tsukuba, JP;
Kazuhiko Tokoro, Tsukuba, JP;
Katsuya Kikuchi, Tsukuba, JP;
Yoshikuni Okada, Tsukuba, JP;
Hiroyuki Fujita, Kawasaki, JP;
Kenichi Kobayashi, Kawasaki, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Shinwa Corp. Ltd., Kanagawa, JP;
Abstract
A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.