The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2008
Filed:
May. 28, 2004
Hiromichi Ebine, Hitachinaka, JP;
Katsuhiko Kikuchi, Hitachinaka, JP;
Satoshi Shimada, Hitachinaka, JP;
Masahide Hayashi, Chiyoda-ku, JP;
Hiromichi Ebine, Hitachinaka, JP;
Katsuhiko Kikuchi, Hitachinaka, JP;
Satoshi Shimada, Hitachinaka, JP;
Masahide Hayashi, Chiyoda-ku, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Car Engineering Co., Ltd., Hitachinaka-shi, JP;
Abstract
An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.