The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7413619 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 19, 2008

Filed:

Feb. 21, 2006
Applicants:

Toshikazu Kawahata, Kanagawa, JP;

Takefumi Ito, Tokyo, JP;

Takenori Sone, Tokyo, JP;

Yumiko Iwashita, Kanagawa, JP;

Toshihiro Kurita, Kanagawa, JP;

Inventors:

Toshikazu Kawahata, Kanagawa, JP;

Takefumi Ito, Tokyo, JP;

Takenori Sone, Tokyo, JP;

Yumiko Iwashita, Kanagawa, JP;

Toshihiro Kurita, Kanagawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

Raw materials for a copper alloy are melted in a high frequency smelter and cast, and milling, rolling, and annealing are carried out. Then, rolling is again carried out. Thereafter, the materials are heated at a temperature of 900° C. for one minute and are quenched in water, to be solution treated. Subsequently, the materials are heated at a temperature of 500° C. for five hours for aging, and then are cooled at a cooling rate in a range of 10 to 50° C. per hour until the materials are cooled to a temperature of 380° C.


Find Patent Forward Citations

Kawahata, Toshikazu. (2008). Copper alloy (U.S. Patent No. 7413619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7413619

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