The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2008
Filed:
Feb. 16, 2005
Vahid Goudarzi, Coral Springs, FL (US);
Julio A. Abdala, Fort Lauderdale, FL (US);
Gulten Goudarzi, Coral Springs, FL (US);
Vahid Goudarzi, Coral Springs, FL (US);
Julio A. Abdala, Fort Lauderdale, FL (US);
Gulten Goudarzi, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method () of reducing stress between substrates of differing materials includes the steps of applying () solder () on a first substrate (), reflowing () the solder on the first substrate to form a cladded substrate (), applying () a medium such as flux or solder on a second substrate () having a substantially different coefficient of thermal expansion than the first substrate, placing () the cladded substrate on the second substrate, and reflowing () the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.