The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2008

Filed:

Oct. 13, 2005
Applicants:

Niraj Mahadev, Milpitas, CA (US);

Winston Jose, San Jose, CA (US);

Tai Dang, Milpitas, CA (US);

Inventors:

Niraj Mahadev, Milpitas, CA (US);

Winston Jose, San Jose, CA (US);

Tai Dang, Milpitas, CA (US);

Assignee:

SAE Magnetics (H.K.) Ltd., Shatin, N.T., HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system and method are described for manufacturing a lapping plate. Diamond particles are premixed with a metal matrix. The diamond particles are electro-deposited onto the surface of a lapping plate. The lapping plate may have a substrate of hard metal with a soft metal coating. The metal matrix and the lapping plate may be the same metal. The metal matrix may be tin, copper, nickel, or silver. The metal matrix may be an alloy of tin, copper, nickel, or silver. The diamond particles may be between 0.1 and 0.25 microns in size. Multiple uniform layers of the diamond particles and metal matrix may be stacked on the lapping plate.


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