The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2008

Filed:

Feb. 13, 2007
Applicants:

Masatoshi Takada, Hitachi, JP;

Koichi Murayama, Hitachi, JP;

Kenji Akagi, Hitachi, JP;

Inventors:

Masatoshi Takada, Hitachi, JP;

Koichi Murayama, Hitachi, JP;

Kenji Akagi, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01); E04B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A module evaluation method and system which can quickly determine overall effectiveness of the modular construction method in an automatic manner, taking into account the transportation cost and so on. A module evaluation unit prepares constructed-equipment physical quantity data from constructed-equipment layout data, and determines an in-module unit-rate reduction effect resulted from executing construction work of the constructed equipment in the module in a factory where working efficiency is higher than a field. The module evaluation unit also determines a module transportation cost effect, a module temporary construction cost effect, and a density reduction effect that is resulted from a reduction of density in a space not occupied by a module with application of modularization and efficiency of installation work is increased. The module evaluation unit further determines a field physical-quantity reduction effect resulted from a reduction of physical quantity in the field and from a reduction of various overhead costs with application of the modularization. The determination results are displayed on a display.


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