The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2008

Filed:

Jul. 26, 2005
Applicants:

Shinichi Takada, Ibaraki, JP;

Kazuhito Okumura, Ibaraki, JP;

Mitsushi Yamamoto, Ibaraki, JP;

Masaki Hayashi, Ibaraki, JP;

Inventors:

Shinichi Takada, Ibaraki, JP;

Kazuhito Okumura, Ibaraki, JP;

Mitsushi Yamamoto, Ibaraki, JP;

Masaki Hayashi, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is to manufacture a surface protective film for transparent conductive films having a rate of thermal shrinkage of no more than 0.9% in both MD (machine direction) and TD (width direction) as measured after being heated at 150° C. for 1 hour. The method includes: providing a base material film; applying an adhesive on one surface of the base material film; and applying a drawing tension of no more than 80 N per width of 1 m of the base material film under conditions of a temperature of 100° C. through 150° C. and a residence time of 20 through 120 seconds, thereby removing a residual stress and simultaneously drying the adhesive.


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