The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Oct. 15, 2003
Xiaohui Qin, Santa Rosa, CA (US);
Deji Akinwande, Falls Church, VA (US);
James P. Stephens, Sebastopol, CA (US);
Robin Zinsmaster, Sebastopol, CA (US);
Jim Clatterbaugh, Santa Rosa, CA (US);
Xiaohui Qin, Santa Rosa, CA (US);
Deji Akinwande, Falls Church, VA (US);
James P. Stephens, Sebastopol, CA (US);
Robin Zinsmaster, Sebastopol, CA (US);
Jim Clatterbaugh, Santa Rosa, CA (US);
Agilent Technologies, Inc., Santa Clara, CA (US);
Abstract
Wire bonds connect current-carrying edges of high-frequency planar conductors to other electrical devices. In one embodiment, planar transmission lines are interconnected using two wire bonds. One bond wire extends from an edge of a first center conductor to a corresponding edge of a second center conductor, and a second bond wire extends from the other edge of the first center conductor to the other edge of the second center conductor. Embodiments include center conductors at different heights and having different widths, and different electrical devices, such as semiconductor integrated circuits. In a particular embodiment, ball bonding is used. In some embodiments, a tack bond is included after a ball bond to allow closer attachment of the bond wire to the edge of the conductor.