The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Nov. 19, 2004
Keiji Tsunetomo, Tokyo, JP;
Shinya Okamoto, Tokyo, JP;
Yasuhiro Saito, Tokyo, JP;
Junji Kurachi, Tokyo, JP;
Akihiro Koyama, Tokyo, JP;
Hirotaka Koyo, Tokyo, JP;
Takeshi Hidaka, Tokyo, JP;
Hiroaki Kasai, Tokyo, JP;
Masamichi Hijino, Kitatsuru-gun, JP;
Yasushi Nakamura, Kitatsuru-gun, JP;
Keiji Tsunetomo, Tokyo, JP;
Shinya Okamoto, Tokyo, JP;
Yasuhiro Saito, Tokyo, JP;
Junji Kurachi, Tokyo, JP;
Akihiro Koyama, Tokyo, JP;
Hirotaka Koyo, Tokyo, JP;
Takeshi Hidaka, Tokyo, JP;
Hiroaki Kasai, Tokyo, JP;
Masamichi Hijino, Kitatsuru-gun, JP;
Yasushi Nakamura, Kitatsuru-gun, JP;
Nippon Sheet Glass Company, Limited, Tokyo, JP;
Olympus Corporation, Tokyo, JP;
Abstract
The present invention improves a method of forming a surface unevenness using a difference in etching rates, and relaxes limitations on substrates in this method. In a method of the present invention, an uneven surface is formed by a method including applying pressure to a predetermined region in a surface of a thin film formed on a substrate, and etching a region including at least a portion of the predetermined region and at least a portion of the reminder of the surface that excludes the predetermined region. An etching rate difference within the thin film increases freedom in selecting a substrate material.