The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Aug. 11, 2005
Akio Taniguchi, Osaka, JP;
Kentaro Takesada, Osaka, JP;
Yutaka Kaneda, Osaka, JP;
Tadashi Kokubo, Osaka, JP;
Nobuaki Ohshiro, Osaka, JP;
Atsushi Kumasaki, Osaka, JP;
Takeshi Chiba, Hyogo, JP;
Tomoki Hiiro, Hyogo, JP;
Akio Taniguchi, Osaka, JP;
Kentaro Takesada, Osaka, JP;
Yutaka Kaneda, Osaka, JP;
Tadashi Kokubo, Osaka, JP;
Nobuaki Ohshiro, Osaka, JP;
Atsushi Kumasaki, Osaka, JP;
Takeshi Chiba, Hyogo, JP;
Tomoki Hiiro, Hyogo, JP;
Kaneka Corporation, Osaka, JP;
Abstract
The present invention relates to a block copolymer (A) including a (meth)acrylic polymer block (a) and an acrylic polymer block (b). The (meth)acrylic polymer block (a) is preferably copolymerized with a monomer having a functional group having high cohesive force, such as a carboxyl group, so that the 5%-weight-loss temperature is 300° C. or more or the tensile strength is 3 MPa or more, and the hardness measured by a type A durometer according to JIS K6253 is 50 or less, and a compression set measured after 22 hours at 70° C. is 45% or less. The block copolymer (A) exhibits excellent thermal decomposition resistance and low compression set at high temperatures. The block copolymer (A) can be used as a soft material for automobile, and has low hardness, high adhesion, high oil resistance, high weather resistance, high heat resistance, high recycling property, high tensile properties, and high wax remover resistance.