The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2008

Filed:

Sep. 10, 2004
Applicants:

Fumikazu Mizutani, Fukuoka, JP;

Hiroshi Takaha, Kanagawa, JP;

Makoto Ishikawa, Fukuoka, JP;

Yasuhiro Kawase, Fukuoka, JP;

Inventors:

Fumikazu Mizutani, Fukuoka, JP;

Hiroshi Takaha, Kanagawa, JP;

Makoto Ishikawa, Fukuoka, JP;

Yasuhiro Kawase, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 3/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A gold plating solution comprising iodide ions, gold iodide complex ions and a non-aqueous solvent, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution. The present invention further provides a gold plating solution comprising iodide ions, gold iodide complex ions, a non-aqueous solvent and a water-soluble polymer, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution and which is capable of forming a gold plating film in which gold crystal particle sizes are very fine and grain boundaries are dense. The present invention further provides a gold plating method employing such a gold plating solution.


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