The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2008

Filed:

Aug. 12, 2005
Applicants:

Sugio Miyazawa, Kasugai, JP;

Shinzo Hayashi, Obu, JP;

Masaru Doi, Mie-Gun, JP;

Inventors:

Sugio Miyazawa, Kasugai, JP;

Shinzo Hayashi, Obu, JP;

Masaru Doi, Mie-Gun, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

A slurry for molding an article is provided wherein a source powder including at least one of a ceramic powder and a metal powder is dispersed, introduced into a forming mold, cured in the forming mold to form the molded article, and at least a part of the forming mold is degraded or dissolved in releasing the molded article from the forming mold. The major components of the slurry include the source powder, a dispersion medium and a gellifying agent, wherein the dispersion medium and the gellifying agent each contain an organic compound having a reactive functional group such that the slurry is cured by a reaction between the organic compound in the dispersion medium and the organic compound in the gellifying agent.


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