The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Jan. 21, 2003
Min Kyo Cho, Seoul, KR;
SA Yoon Kang, Seoul, KR;
Young Hoon RO, Cheonan, KR;
Young Shin Kwon, Yongin, KR;
Min Kyo Cho, Seoul, KR;
Sa Yoon Kang, Seoul, KR;
Young Hoon Ro, Cheonan, KR;
Young Shin Kwon, Yongin, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.