The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Nov. 21, 2005
Katsumi Ishikawa, Takahama, JP;
Hiroshi Takei, Anjo, JP;
Nobuya Makino, Anjo, JP;
Tetsuro Yano, Handa, JP;
Katsumi Ishikawa, Takahama, JP;
Hiroshi Takei, Anjo, JP;
Nobuya Makino, Anjo, JP;
Tetsuro Yano, Handa, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.