The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Jun. 22, 2005
Satoshi Terayama, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Satoshi Terayama, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
In a manufacturing method of a semiconductor device, a semiconductor substrate having a plurality of semiconductor chips formed on one of principal surfaces of the substrate is cut into the plurality of semiconductor chips through dicing. A first cutting process is formed on one of the principal surfaces of the substrate to produce two cutting grooves between two neighboring ones of the plurality of semiconductor chips, each cutting groove being adjacent to one of the neighboring ones of the plurality of semiconductor chips. A second cutting process is performed on the other of the principal surfaces of the substrate to produce a cutting groove overlapping the two cutting grooves produced by the first cutting process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile