The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Mar. 08, 2006
Applicants:
Hidemichi Furihata, Chino, JP;
Satoshi Kimura, Fujimi, JP;
Inventors:
Hidemichi Furihata, Chino, JP;
Satoshi Kimura, Fujimi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/00 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active agent layer, and (d) precipitating a metal layer above the catalyst layer.
Furihata, Hidemichi. (2008). Plating method and electronic device (U.S. Patent No. 7404885). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7404885
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile