The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Jul. 13, 2006
Masaaki Tanaka, Kariya, JP;
Tsutomu Onoue, Kariya, JP;
Masaaki Tanaka, Kariya, JP;
Tsutomu Onoue, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A method of manufacturing a sensor device includes a step of forming a sensor chip including a sensing element and a wiring portion connected to the sensing element on a substrate, a step of connecting the wiring portion to a lead, and a step of molding a member for covering a connecting portion between the wiring portion and the lead by injecting a molding material in a mold, while the sensing element is exposed. In the molding step, a buffering member is disposed between an area to be covered with the molded member and the sensing element. Furthermore, in the molding step, the buffering member is deformed by a pressure from the mold, and the molding material is injected in the deformed state of the buffering member so as to form the molded member.