The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Nov. 30, 2006
Takashi Fujimoto, Takeo, JP;
Hiroto Nagaishi, Kashima, JP;
Shoichi Konagata, Ureshino, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.