The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Feb. 27, 2004
Applicants:
Harald Böttner, Freiburg, DE;
Axel Schubert, Munich, DE;
Martin Jaegle, Sexau, DE;
Inventors:
Assignees:
Micropelt GmbH, Freiburg, DE;
Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V., Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.
Böttner, Harald. (2008). Solder, microelectromechanical component and device, and a process for producing a component or device (U.S. Patent No. 7402910). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7402910
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile