The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2008

Filed:

Jul. 12, 2005
Applicants:

Ruben P. Madrid, Lapu-lapu, PH;

Marvin Gestole, Lapu-lapu, PH;

Erwin Victor R. Cruz, Koronadal, PH;

Romel N. Madatad, Mandaue, PH;

Arniel Jaud, Mandaue, PH;

Paul Armand Calo, Cebu, PH;

Inventors:

Ruben P. Madrid, Lapu-lapu, PH;

Marvin Gestole, Lapu-lapu, PH;

Erwin Victor R. Cruz, Koronadal, PH;

Romel N. Madatad, Mandaue, PH;

Arniel Jaud, Mandaue, PH;

Paul Armand Calo, Cebu, PH;

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A folded frame carrier has a die attach pad (DAP)and one or more folded edges. Each folded edge has one or more studsand each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or copper alloy. Multiple folded frame carriers may be formed between opposite rails of a lead frame. The folded edges are cut with a relief groove. The tips are formed in edges of the DAP and then the tips are folded upright. The tips provide electrical connection to the terminal on the rear surface of a power semiconductor mounted on the DAP.


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