The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2008

Filed:

Sep. 25, 2002
Applicants:

Kerstin Häse, Ottobrunn, DE;

Laurence Amigues, München, DE;

Herbert Schwarzbauer, München, DE;

Norbert Seliger, München, DE;

Karl Weidner, München, DE;

Jörg Zapf, München, DE;

Matthias Rebhan, Riemerling, DE;

Inventors:

Kerstin Häse, Ottobrunn, DE;

Laurence Amigues, München, DE;

Herbert Schwarzbauer, München, DE;

Norbert Seliger, München, DE;

Karl Weidner, München, DE;

Jörg Zapf, München, DE;

Matthias Rebhan, Riemerling, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.


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