The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Oct. 14, 2004
Hiroki Tarui, Kariya, JP;
Masafumi Takahashi, Nagoya, JP;
Tsuguharu Shimpo, Owariasahi, JP;
Koji Onouchi, Gamagori, JP;
Hiroshi Ogawa, Nagoya, JP;
Hiroki Tarui, Kariya, JP;
Masafumi Takahashi, Nagoya, JP;
Tsuguharu Shimpo, Owariasahi, JP;
Koji Onouchi, Gamagori, JP;
Hiroshi Ogawa, Nagoya, JP;
Denso Corporation, Kariya, JP;
Abstract
For integrally bonding a first member and a second member made of copper or a copper alloy by brazing, a paste brazing material composed essentially of copper (Cu), tin (Sn), nickel (Ni) and phosphorus (P) is beforehand applied to at least one of the first and second members. A base material is exposed at the whole or a part of a contact portion between the first and second members. Thereafter, the first and second members are assembled at a predetermined position, and heated at a temperature in a range of 600° C.-800° C. within a reducing atmosphere furnace. By the brazing method, an oxide film on the surface of the base material can be sufficiently removed, so that the paste brazing material can smoothly flow on the surface at the contact portion.