The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
May. 17, 2004
Motoko Kimura, Kawasaki, JP;
Takeshi Miitsu, Hadano, JP;
Takeshi Takahashi, Hadano, JP;
Kaoru Katayama, Hadano, JP;
Shiro Yamashita, Fujisawa, JP;
Motoko Kimura, Kawasaki, JP;
Takeshi Miitsu, Hadano, JP;
Takeshi Takahashi, Hadano, JP;
Kaoru Katayama, Hadano, JP;
Shiro Yamashita, Fujisawa, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.