The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Apr. 21, 2005
Yuhsuke Matsumoto, Kanagawa, JP;
Tatsushi Yoshida, Kanagawa, JP;
Takaaki Murokawa, Kanagawa, JP;
Tatsumi Tsuchiya, Kanagawa, JP;
Yoshio Uematsu, Kanagawa, JP;
Nobuyuki Hashi, Kanagawa, JP;
Yuhsuke Matsumoto, Kanagawa, JP;
Tatsushi Yoshida, Kanagawa, JP;
Takaaki Murokawa, Kanagawa, JP;
Tatsumi Tsuchiya, Kanagawa, JP;
Yoshio Uematsu, Kanagawa, JP;
Nobuyuki Hashi, Kanagawa, JP;
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m) of an electrode stud are in a relation of R≧4S.