The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2008

Filed:

Mar. 27, 2007
Applicants:

Gary W. Grube, Pleasanton, CA (US);

Igor Y. Khandros, Orinda, CA (US);

Benjamin N. Eldridge, Danville, CA (US);

Gaetan L. Mathieu, Livermore, CA (US);

Poya Lotfizadeh, San Francisco, CA (US);

Chih-chiang Tseng, Dublin, CA (US);

Inventors:

Gary W. Grube, Pleasanton, CA (US);

Igor Y. Khandros, Orinda, CA (US);

Benjamin N. Eldridge, Danville, CA (US);

Gaetan L. Mathieu, Livermore, CA (US);

Poya Lotfizadeh, San Francisco, CA (US);

Chih-Chiang Tseng, Dublin, CA (US);

Assignee:

FormFactor, Inc., Livermore, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G06F 17/50 (2006.01); H01L 29/10 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.


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