The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2008

Filed:

Dec. 15, 2003
Applicants:

Junichi Shimada, Kyoto, JP;

Yoichi Kawakami, Kusatsu, JP;

Inventors:

Junichi Shimada, Kyoto, JP;

Yoichi Kawakami, Kusatsu, JP;

Assignee:

Yanchers Inc., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layermade of diamond is provided on a substrate, and on top of this, a conductive layerhaving a predetermined pattern is formed. LED chipsare mounted in predetermined positions on the conductive layer. Terminals of the conductive layerand electrodes of the LED chipsare connected to each other. A connector partfor the connection to a socket is provided in an end portion of the substrate. The heat conducting layeron the connector partmakes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chipsthrough the conductive layerfrom the socket, and respective LED chipsemit light. Heat that is generated in the LED chipsis released to the outside of the illumination system from the socket through the conductive layer, the heat conducting layerand the connector part. As a result of this, an increase in the temperature of the LED chipscan be prevented, and an LED illumination system that emits a large amount of light can be formed.


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