The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
May. 06, 2003
Oliver Stoll, Reutlingen, DE;
Franz Laermer, Weil Der Stadt, DE;
Gilbert Moersch, Stuttgart, DE;
Gottfried Flik, Leonberg, DE;
Klaus Kuettner, Stuttgart, DE;
Oliver Stoll, Reutlingen, DE;
Franz Laermer, Weil Der Stadt, DE;
Gilbert Moersch, Stuttgart, DE;
Gottfried Flik, Leonberg, DE;
Klaus Kuettner, Stuttgart, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method for producing a component is provided, in particular a deformation sensor, having a sensor element which includes at least one region that is sensitive with respect to expansion or compression, as well as electrical structures which are in connection therewith. To this end, a sacrificial layer is produced on or within a substrate and an activatable layer on top of the sacrificial layer, the sensitive region and at least a portion of the electrical structures being positioned on top or within an activatable layer, and a circumferential trench is produced around the region of the sensor element to be produced and having the sensitive region and the portion of the electrical structures, the trench being interrupted by at least one connecting point, which connects the region of the sensor element to the portion of the activatable layer lying outside the circumferential trench. This is followed by a removal of the sacrificial layer underneath the region of the sensor element, a fixation of the region of the sensor element with the aid of a holding device, rupturing of the connecting points and a transfer of the sensor element, fixated by the holding device, and connecting a carrier to the component as well as joining with a carrier to the component.