The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Oct. 06, 2004
Hideo Morimoto, Yamatokooriyama, JP;
Hideo Morimoto, Yamatokooriyama, JP;
Nitta Corporation, Osaka, JP;
Abstract
Disclosed is a method for manufacturing a capacitance type sensor comprising an insert molding process for insert-molding, with an insulating material, a part of a lead wire of a leadframe and a range of the leadframe including the capacitance element electrode, the leadframe being formed by integrally forming with a frame the capacitance element electrode and the lead wire thereof in a predetermined pattern. The method comprises a cutting process for cutting the lead wire of the capacitance element electrode off the frame. It further comprises a conductive member arranging process for arranging, to a mold product obtained by the insert molding process, the conductive member at a distance from the capacitance element electrode. Also included is a movable electrode arranging process for arranging, to the mold product, the movable electrode to be in contact with the lead wire of the movable electrode at a distance from the conductive member.